Tuesday, October 11, 2016

16:30 – 19:00

Opening reception and poster session

Wednesday, October 12, 2016

9:00 – 9:15

Opening remarks

Laurent Pain, Raluca Tiron, Leti

9:15 – 9:50

Keynote Presentation:

From Lab to Fab: the DSA Journey

Chandra Sarma, Intel Corporation

Session 1: DSA integration

9:50 – 10:10

Impact of template shape on pattern placement and CDU for grapho-epitaxy DSA

Carolien Boeckx, imec

10:10 – 10:30

Defect reduction results for chemo-epitaxy DSA lines

Makoto Muramatsu, TEL

10:30 - 10:50

Comparative study of SIS of Ti and Al oxides on PS-b-PMMA block copolymers 

Marina Baryshnikova, imec

10:50 – 11:20

Break

Session 2: Design

11:20 – 11:40

Impact of DSA process variability on circuit performance

Ioannis Karageorgos, imec

11:40 – 12:00

Reduction of error placement sensitivity to guiding patterns in cylinder forming Grapho-epitaxy processes, by model-based synthesis.

Joydeep Mitra, Mentor Graphics

12:00 – 12:20

Density-Balancing Mask Assignment for Via Patterning with Directed Self-Assembly

Maryann C. Tung, Stanford Univ.

Lunch/ Poster session /Invited presentation

12:20 – 13:20

Lunch

13:20 – 14:40

Poster session

14:40 – 15:10

Invited paper:

Directed Self-Assembly of Block Copolymer Thin Films on Flexible and Transferrable Graphene Based Substrates

Sang Ouk Kim, KAIST

Session 3: High c BCP materials

15:10 – 15:30

Advances in DSA with high c silicon containing block copolymers

Grant Willson, Univ. of Texas at Austin

15:30 – 15:50

Topcoat-free Strategies for Orientation Control of All-organic High-χ Block Copolymers

Ankit Vora, IBM

15:50 – 16:10

Si-containing high-c block-copolymers for nanolithography applications

Marc Zelsmann, LTM

16:10 – 16:40

Break

Session 4: Metrology

16:40 – 17:00

Metrology-based design of materials and processes for DSA

Paul Nealey, Univ. of Chicago

17:00 – 17:20

Defectivity monitoring for DSA contact hole application

Florian Delachat, Leti

17:20 – 17:40

Understanding defectivity in CHIPS flow hexagonal arrays and strategies for improvement

Arjun Singh, imec

17:40 – 18:00

Measuring the Interfacial Width of Block Copolymers

Daniel F. Sunday, NIST

19:00 – 22:30

Conference Dinner

Thursday, October 13, 2016

9:00 – 9:35

Keynote presentation:

Lithography Directing Self Assembly

Sander Wuister, ASML

Session 5: Processing

9:35 – 9:55

DSA Via Hole Shrink for Advanced Node Applications

Hitoshi Osaki, JSR

 9:55 – 10:15

The 300mm evaluation of a 38nm period lamellar PS-b-PMMA for L/S applications with graphoepitaxy.

Guillaume Claveau, Leti

10:15 – 10:35

Sequential infiltration synthesis of oxide nanostructures in block copolymer based templates using ozone as oxygen precursor

Michele Perego, IMM, CNR

10:35 – 10:55

Lithographic performances evaluation of directed self-assembly of block copolymers for shrink and doubling contacts

Shayma Bouanani, ST Microelectronics

10:55 – 11:20

Break

Session 6: BCP Materials

11:20 – 11:40

Materials resists and formulations for improvement of DSA defectivity and features

Xavier Chevalier, Arkema

11:40 – 12:00

Influence of block copolymer composition in grapho-epitaxy directed self-assembly for contact hole multiplication

Jan Doise, imec

12:00 – 12:20

Directed Self-assembly of PS-b-PMMA with Ionic Liquid Addition

Xuanxuan Chen, Univ of Chicago

Lunch/ Invited Presentation

12:20 – 13:20

Lunch

13:20 – 13:50

Invited presentation: Defect motion and annihilation in DSA of lamella-forming copolymers

Marcus Muller, Univ. of Gottingen

Session 7: Simulation

13:50 – 14:10

Modeling study of 3D morphologies for a line multiplication process

Andreas Erdmann, Fraunhofer IISB

14:10 – 14:30

Integer Programming for DSA grouping and Multiple Patterning Lithography

Dehia Ait-Ferhat, Mentor Graphics Corporation

Session 8: DSA Processing and Integration

14:30 – 14:50

Tsukasa Azuma, EIDEC

14:50 – 15:20

Break

15:20 – 15:40

Control of interface energies for implementing directed self-assembly of block copolymers in a 300 mm CMOS processing line

Marta Fernandez Regulez, IMB-CNM

15:40 – 16:00

DSA Process Window Extension and Stability Improvement via Controlled Atmospheric Conditions

Maxime Argoud, LETI

Discussion, Voting and adjourn

16:00 – 17:20

Debate and Voting

all

17:20 – 17:30

Closing Remarks

Laurent Pain, Raluca Tiron, Leti

17:30 – 18:30

Closing reception and Adjourn

Friday, October 14, 2016

COLISA – PLACYD joint workshop