The scope of the Symposium will include:

▸Materials (BCP, surface control layers, additives, ...)
▸Processing
▸DSA-friendly design and OPC
▸Etch
▸Simulations
▸2D and 3D Metrology
▸Pattern placement
▸Integration
▸DSA extendibility

We aim for a mix of industrial and academic contributions to tackle practical as well as fundamental aspects of the technology.